Inventor

BRUNNER HEIKO

DE23 patents

⚠️ This page may combine multiple inventors who share the name “BRUNNER HEIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUNNER HEIKO

ATOTECH DEUTSCHLAND GMBH

Copper plating bath composition

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

Galvanic nickel electroplating bath for depositing a semi-bright nickel

Plating bath compositions for electroless plating of metals and metal alloys

Plating bath for electroless deposition of nickel layers

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

Alkaline plating bath for electroless deposition of cobalt alloys

Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

Metal or metal alloy deposition composition and plating compound

Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds

Plating bath composition and method for electroless plating of palladium

Electrolytic copper plating bath compositions and a method for their use

BRUNNER HEIKO

Aqueous, acid bath and method for the electrolytic deposition of copper

Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths

HARTMANN PHILIP

Pyrophosphate-based bath for plating of tin alloy layers

SPARING CHRISTIAN

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

ATOTECH DEUTSCHLAND GMBH & CO KG

Copper electroplating bath

VOSS TORSTEN

Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)