Inventor
MAHADEV VADALI
US6 patents
⚠️ This page may combine multiple inventors who share the name “MAHADEV VADALI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ALTERA CORP
4 patentsUS7585702B1Sep 8, 2009
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
ALTERA CORP38 citations94
US7741160B1Jun 22, 2010
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
ALTERA CORP9 citations82
US7210081B1Apr 24, 2007
Apparatus and methods for assessing reliability of assemblies using programmable logic devices
ALTERA CORP13 citations78
US10048306B1Aug 14, 2018
Methods and apparatus for automated integrated circuit package testing
ALTERA CORP12 citations76