Inventor
ESTES RICHARD H
US12 patents
⚠️ This page may combine multiple inventors who share the name “ESTES RICHARD H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POLYMER FLIP CHIP CORP
6 patentsUS6410415B1Jun 25, 2002
Flip chip mounting technique
POLYMER FLIP CHIP CORP249 citations98
US6189208B1Feb 20, 2001
Flip chip mounting technique
POLYMER FLIP CHIP CORP168 citations98
US6138348AOct 31, 2000
Method of forming electrically conductive polymer interconnects on electrical substrates
POLYMER FLIP CHIP CORP90 citations98
US6219911B1Apr 24, 2001
Flip chip mounting technique
POLYMER FLIP CHIP CORP120 citations97
US5879761AMar 9, 1999
Method for forming electrically conductive polymer interconnects on electrical substrates
POLYMER FLIP CHIP CORP44 citations95
US5918364AJul 6, 1999
Method of forming electrically conductive polymer interconnects on electrical substrates
POLYMER FLIP CHIP CORP30 citations92
EPOXY TECHNOLOGY INC
4 patentsUS5611140AMar 18, 1997
Method of forming electrically conductive polymer interconnects on electrical substrates
EPOXY TECHNOLOGY INC201 citations98
US5237130AAug 17, 1993
Flip chip technology using electrically conductive polymers and dielectrics
EPOXY TECHNOLOGY INC207 citations98
US5196371AMar 23, 1993
Flip chip bonding method using electrically conductive polymer bumps
EPOXY TECHNOLOGY INC251 citations98
US5074947ADec 24, 1991
Flip chip technology using electrically conductive polymers and dielectrics
EPOXY TECHNOLOGY INC260 citations98