Inventor · disambiguated record
Hong-Ku Paik
Also filed as: PAIK HONG-KU
2 granted patents·104 citations·filing 1997–1998
69Inventor score
Technology areasH10P
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0183US5892254AIntegrated circuit capacitors including barrier layers having grain boundary filling materialSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 6, 1999·64 cites·32 claims
- 0274US6180447B1Methods for fabricating integrated circuit capacitors including barrier layers having grain boundary filling materialSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jan 30, 2001·40 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →