Inventor
SENGUPTA DIPAK
US15 patents
⚠️ This page may combine multiple inventors who share the name “SENGUPTA DIPAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ANALOG DEVICES INC
9 patentsUS6534340B1Mar 18, 2003
Cover cap for semiconductor wafer devices
ANALOG DEVICES INC149 citations98
US7871865B2Jan 18, 2011
Stress free package and laminate-based isolator package
ANALOG DEVICES INC23 citations91
US8767982B2Jul 1, 2014
Microphone module with sound pipe
ANALOG DEVICES INC7 citations81
US9728510B2Aug 8, 2017
Cavity package with composite substrate
ANALOG DEVICES INC2 citations72
US9731959B2Aug 15, 2017
Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same
ANALOG DEVICES INC3 citations69
US10593634B2Mar 17, 2020
Packaged devices with integrated antennas
ANALOG DEVICES INC2 citations66
US9142470B2Sep 22, 2015
Packages and methods for packaging
ANALOG DEVICES INC3 citations59
US10884551B2Jan 5, 2021
Integrated gesture sensor module
ANALOG DEVICES INC1 citations55
US10490510B2Nov 26, 2019
Cavity package with composite substrate
ANALOG DEVICES INC0 citations51