Inventor
HUANG HANK
TW11 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
9 patentsUS6770958B2Aug 3, 2004
Under bump metallization structure
TAIWAN SEMICONDUCTOR MFG80 citations98
US6656827B1Dec 2, 2003
Electrical performance enhanced wafer level chip scale package with ground
TAIWAN SEMICONDUCTOR MFG142 citations98
US6596619B1Jul 22, 2003
Method for fabricating an under bump metallization structure
TAIWAN SEMICONDUCTOR MFG48 citations96
US6782897B2Aug 31, 2004
Method of protecting a passivation layer during solder bump formation
TAIWAN SEMICONDUCTOR MFG52 citations92
US6774026B1Aug 10, 2004
Structure and method for low-stress concentration solder bumps
TAIWAN SEMICONDUCTOR MFG14 citations84
US6960518B1Nov 1, 2005
Buildup substrate pad pre-solder bump manufacturing
TAIWAN SEMICONDUCTOR MFG12 citations83
US6638837B1Oct 28, 2003
Method for protecting the front side of semiconductor wafers
TAIWAN SEMICONDUCTOR MFG12 citations73
US6884662B1Apr 26, 2005
Enhanced adhesion strength between mold resin and polyimide
TAIWAN SEMICONDUCTOR MFG2 citations62
US7390697B2Jun 24, 2008
Enhanced adhesion strength between mold resin and polyimide
TAIWAN SEMICONDUCTOR MFG0 citations51