Inventor
YAO XIAOWEI
US5 patents
⚠️ This page may combine multiple inventors who share the name “YAO XIAOWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS6821032B2Nov 23, 2004
Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs
INTEL CORP28 citations89
US7350987B2Apr 1, 2008
Optical package fiber pass-through to reduce curvature of optical fiber during threading
INTEL CORP2 citations60
US7405155B2Jul 29, 2008
Circuit package and method of plating the same
INTEL CORP0 citations51
US7019394B2Mar 28, 2006
Circuit package and method of plating the same
INTEL CORP0 citations51