Inventor
BUDELL TIMOTHY W
US20 patents
⚠️ This page may combine multiple inventors who share the name “BUDELL TIMOTHY W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6793500B1Sep 21, 2004
Radial contact pad footprint and wiring for electrical components
IBM20 citations90
US6762367B2Jul 13, 2004
Electronic package having high density signal wires with low resistance
IBM13 citations84
US6978214B2Dec 20, 2005
Validation of electrical performance of an electronic package prior to fabrication
IBM12 citations82
US7017128B2Mar 21, 2006
Concurrent electrical signal wiring optimization for an electronic package
IBM8 citations73
US6703706B2Mar 9, 2004
Concurrent electrical signal wiring optimization for an electronic package
IBM8 citations73
US8952503B2Feb 10, 2015
Organic module EMI shielding structures and methods
IBM4 citations72
US7146596B2Dec 5, 2006
Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid
IBM10 citations71
US6977345B2Dec 20, 2005
Vents with signal image for signal return path
IBM6 citations71
US6945791B2Sep 20, 2005
Integrated circuit redistribution package
IBM8 citations71
US7197446B2Mar 27, 2007
Hierarchical method of power supply noise and signal integrity analysis
IBM9 citations69
US7275229B2Sep 25, 2007
Auto connection assignment system and method
IBM7 citations67
US7882469B2Feb 1, 2011
Automatic verification of adequate conductive return-current paths
IBM5 citations61
US7454723B2Nov 18, 2008
Validation of electrical performance of an electronic package prior to fabrication
IBM2 citations60
US7351917B2Apr 1, 2008
Vents with signal image for signal return path
IBM2 citations60
US7765509B2Jul 27, 2010
Auto connection assignment system and method
IBM3 citations56
US9245854B2Jan 26, 2016
Organic module EMI shielding structures and methods
IBM1 citations51
US7196908B2Mar 27, 2007
Dual pitch contact pad footprint for flip-chip chips and modules
IBM0 citations41