Inventor
LOUBET NICOLAS
US223 patents
⚠️ This page may combine multiple inventors who share the name “LOUBET NICOLAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
23 patentsUS8956942B2Feb 17, 2015
Method of forming a fully substrate-isolated FinFET transistor
ST MICROELECTRONICS INC41 citations98
US8975168B2Mar 10, 2015
Method for the formation of fin structures for FinFET devices
ST MICROELECTRONICS INC23 citations93
US8952420B1Feb 10, 2015
Method to induce strain in 3-D microfabricated structures
ST MICROELECTRONICS INC19 citations93
US8759874B1Jun 24, 2014
FinFET device with isolated channel
ST MICROELECTRONICS INC31 citations93
US10515965B2Dec 24, 2019
Method to induce strain in finFET channels from an adjacent region
ST MICROELECTRONICS INC4 citations84
US10505043B2Dec 10, 2019
Semiconductor device with fin and related methods
ST MICROELECTRONICS INC3 citations84
US10483393B2Nov 19, 2019
Method to induce strain in 3-D microfabricated structures
ST MICROELECTRONICS INC4 citations84
US10177255B2Jan 8, 2019
Semiconductor device with fin and related methods
ST MICROELECTRONICS INC4 citations84
US10062690B2Aug 28, 2018
Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
ST MICROELECTRONICS INC5 citations84
US10043805B2Aug 7, 2018
Method to induce strain in finFET channels from an adjacent region
ST MICROELECTRONICS INC4 citations84
US9806196B2Oct 31, 2017
Semiconductor device with fin and related methods
ST MICROELECTRONICS INC4 citations84
US9685380B2Jun 20, 2017
Method to co-integrate SiGe and Si channels for finFET devices
ST MICROELECTRONICS INC8 citations84
US9679899B2Jun 13, 2017
Co-integration of tensile silicon and compressive silicon germanium
ST MICROELECTRONICS INC5 citations84
US9620507B2Apr 11, 2017
Silicon-on-nothing transistor semiconductor structure with channel epitaxial silicon-germanium region
ST MICROELECTRONICS INC6 citations84
US9548361B1Jan 17, 2017
Method of using a sacrificial gate structure to make a metal gate FinFET transistor
ST MICROELECTRONICS INC6 citations84
US9520393B2Dec 13, 2016
Fully substrate-isolated FinFET transistor
ST MICROELECTRONICS INC9 citations84
US9466720B2Oct 11, 2016
Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
ST MICROELECTRONICS INC5 citations84
US9466718B2Oct 11, 2016
Semiconductor device with fin and related methods
ST MICROELECTRONICS INC8 citations84
US9406783B2Aug 2, 2016
Method to induce strain in finFET channels from an adjacent region
ST MICROELECTRONICS INC5 citations84
US9245953B2Jan 26, 2016
Method to induce strain in 3-D microfabricated structures
ST MICROELECTRONICS INC6 citations84
US9166023B2Oct 20, 2015
Bulk finFET semiconductor-on-nothing integration
ST MICROELECTRONICS INC13 citations84
US9099559B2Aug 4, 2015
Method to induce strain in finFET channels from an adjacent region
ST MICROELECTRONICS INC6 citations84
US9018057B1Apr 28, 2015
Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
ST MICROELECTRONICS INC10 citations84
IBM
13 patentsUS10573755B1Feb 25, 2020
Nanosheet FET with box isolation on substrate
IBM32 citations94
US10424651B2Sep 24, 2019
Forming nanosheet transistor using sacrificial spacer and inner spacers
IBM16 citations94
US10367061B1Jul 30, 2019
Replacement metal gate and inner spacer formation in three dimensional structures using sacrificial silicon germanium
IBM23 citations94
US10998234B2May 4, 2021
Nanosheet bottom isolation and source or drain epitaxial growth
IBM11 citations86
US10903315B2Jan 26, 2021
Formation of dielectric layer as etch-stop for source and drain epitaxy disconnection
IBM12 citations86
US10748901B2Aug 18, 2020
Interlayer via contacts for monolithic three-dimensional semiconductor integrated circuit devices
IBM11 citations86
US10170520B1Jan 1, 2019
Negative-capacitance steep-switch field effect transistor with integrated bi-stable resistive system
IBM19 citations86
US10832964B1Nov 10, 2020
Replacement contact formation for gate contact over active region with selective metal growth
IBM8 citations84
US10546942B2Jan 28, 2020
Nanosheet transistor with optimized junction and cladding defectivity control
IBM7 citations84
US10388760B1Aug 20, 2019
Sub-thermal switching slope vertical field effect transistor with dual-gate feedback loop mechanism
IBM4 citations84
US10256316B1Apr 9, 2019
Steep-switch field effect transistor with integrated bi-stable resistive system
IBM7 citations84
US9219078B2Dec 22, 2015
Simplified multi-threshold voltage scheme for fully depleted SOI MOSFETs
IBM11 citations84
US9171757B2Oct 27, 2015
Dual shallow trench isolation liner for preventing electrical shorts
IBM8 citations84
GLOBALFOUNDRIES INC
7 patentsUS10388732B1Aug 20, 2019
Nanosheet field-effect transistors including a two-dimensional semiconducting material
GLOBALFOUNDRIES INC88 citations98
US10276442B1Apr 30, 2019
Wrap-around contacts formed with multiple silicide layers
GLOBALFOUNDRIES INC29 citations94
US10366931B2Jul 30, 2019
Nanosheet devices with CMOS epitaxy and method of forming
GLOBALFOUNDRIES INC6 citations84
US9627245B2Apr 18, 2017
Methods of forming alternative channel materials on a non-planar semiconductor device and the resulting device
GLOBALFOUNDRIES INC7 citations84
US9349730B2May 24, 2016
Fin transformation process and isolation structures facilitating different Fin isolation schemes
GLOBALFOUNDRIES INC11 citations84
US9263580B2Feb 16, 2016
Methods of forming isolated channel regions for a FinFET semiconductor device and the resulting device
GLOBALFOUNDRIES INC9 citations84
US9093496B2Jul 28, 2015
Process for faciltiating fin isolation schemes
GLOBALFOUNDRIES INC19 citations84
LIU QING
3 patentsUS9093556B2Jul 28, 2015
Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
LIU QING9 citations92
US9012999B2Apr 21, 2015
Semiconductor device with an inclined source/drain and associated methods
LIU QING10 citations84
US9000555B2Apr 7, 2015
Electronic device including shallow trench isolation (STI) regions with bottom nitride liner and upper oxide liner and related methods
LIU QING7 citations84
BASKER VEERARAGHAVAN S
2 patentsCOMMISSARIAT ENERGIE ATOMIQUE
1 patentDORIS BRUCE B
1 patentShowing the top 50 of 223 patents by PatentIndex Score.