Inventor
Cheng Tai-Shin
TW5 patents
Patents
5 patentsUS9761488B2Sep 12, 2017
Method for cleaning via of interconnect structure of semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations82
US9536964B2Jan 3, 2017
Method for forming via profile of interconnect structure of semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations82
US9997520B2Jun 12, 2018
Semiconductor device structure with capacitor and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US9997401B2Jun 12, 2018
Method for forming a via profile of interconnect structure of semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50
US9425087B1Aug 23, 2016
Method for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50