Inventor
HOR JOON TEIK
MY6 patents
⚠️ This page may combine multiple inventors who share the name “HOR JOON TEIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS11663154B2May 30, 2023
Virtualized link states of multiple protocol layer package interconnects
INTEL CORP2 citations71
US11308018B2Apr 19, 2022
Virtualized link states of multiple protocol layer package interconnects
INTEL CORP2 citations71
US10776302B2Sep 15, 2020
Virtualized link states of multiple protocol layer package interconnects
INTEL CORP2 citations71
US12001353B2Jun 4, 2024
System, apparatus and method for synchronizing multiple virtual link states over a package interconnect
INTEL CORP0 citations61
US11442876B2Sep 13, 2022
System, apparatus and method for synchronizing multiple virtual link states over a package interconnect
INTEL CORP0 citations61