Inventor

LIU DING-I

TW46 patents

⚠️ This page may combine multiple inventors who share the name “LIU DING-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU DING-I

TAIWAN SEMICONDUCTOR MFG CO LTD

Showerhead, semicondcutor processing apparatus having the same and semiconductor process

Thermal chemical vapor deposition system and operating method thereof

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device having multi-layer diffusion barrier and method of making the same

Semiconductor device having a multi-layer diffusion barrier

Method for controlling plasma in semiconductor fabrication

Coating apparatus and method of forming coating film

Apparatus and operation method thereof

Coating apparatus and method of forming coating film

Equipment module with enhanced protection from airborne contaminants, and method of operation

Electron migration control in interconnect structures

Electron migration control in interconnect structures

Electron migration control in interconnect structures

Amorphous layers for reducing copper diffusion and method forming same

Method of using high density plasma chemical vapor deposition chamber

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device having a multi-layer diffusion barrier and method of making the same

High density plasma chemical vapor deposition chamber and method of using

Method of controlling an adjustable nozzle and method of making a semiconductor device

Method of manufacturing semiconductor device and semiconductor devices

Method of manufacturing semiconductor devices including formation of adhesion enhancement layer

Method of manufacturing semiconductor devices and semiconductor devices

Method of manufacturing semiconductor devices and semiconductor devices

Deposition device structure

Aluminum-containing layers and methods of forming the same

Gap fill self planarization on post EPI

Gap fill self planarization on post EPI

Semiconductor device having a shallow trench isolation structure and methods of forming the same

Semiconductor structure with anti-etch structure in via and method for manufacturing the same

Method and system for controlling plasma in semiconductor fabrication

Thin film deposition apparatus with multi chamber design and film deposition methods

Profile pre-shaping for replacement poly gate interlayer dielectric

Semiconductor device having a shallow trench isolation structure and methods of forming the same

Thermal chemical vapor deposition system and operating method thereof

Semiconductor structure with protection layer

Structure and method of semiconductor device structure with gate

High density plasma reactor with multiple top coils

Substrate heat treatment apparatus and heat treatment method

WANG LAN-HAI

Asymmetrical chamber configuration

Apparatus for dielectric deposition process

TAIWAN SEMICONDUCTOR MFG

Method of forming interlayer dielectric film above metal gate of semiconductor device

Gas delivery for uniform film properties at UV curing chamber

CHANG JEN-CHI

Interlayer dielectric structure with high aspect ratio process (HARP)

WU WEI CHING

Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzle

LI YI-FANG

Mechanism of patterning a semiconductor device and product resulting therefrom

CHIANG CHIH-WEI

Profile pre-shaping for replacement poly gate interlayer dielectric