P

Inventor

HSU KAI-SHIUNG

TW16 patents
⚠️ This page may combine multiple inventors who share the name “HSU KAI-SHIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

15 patents
US10161041B2Dec 25, 2018

Thermal chemical vapor deposition system and operating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations79
US11315829B2Apr 26, 2022

Amorphous layers for reducing copper diffusion and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12444647B2Oct 14, 2025

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354907B2Jul 8, 2025

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11264273B2Mar 1, 2022

Electron migration control in interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354908B2Jul 8, 2025

Amorphous layers for reducing copper diffusion and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11967522B2Apr 23, 2024

Amorphous layers for reducing copper diffusion and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12148656B2Nov 19, 2024

Method of manufacturing semiconductor device and semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11322397B2May 3, 2022

Method of manufacturing semiconductor devices including formation of adhesion enhancement layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12020947B2Jun 25, 2024

Method of manufacturing semiconductor devices and semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US11069534B2Jul 20, 2021

Method of manufacturing semiconductor devices and semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US10626499B2Apr 21, 2020

Deposition device structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations57
US10978337B2Apr 13, 2021

Aluminum-containing layers and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US12406867B2Sep 2, 2025

Split valve air curtain

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US10724140B2Jul 28, 2020

Thermal chemical vapor deposition system and operating method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47

CHANG JEN-CHI

1 patent