Inventor
DOBSON TODD A
US8 patents
Patents
8 patentsUS6103636AAug 15, 2000
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC122 citations98
US6329301B1Dec 11, 2001
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC25 citations96
US6610610B2Aug 26, 2003
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC13 citations92
US6447634B1Sep 10, 2002
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC23 citations90
US6889698B2May 10, 2005
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations73
US6530113B2Mar 11, 2003
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC8 citations73
US7244681B2Jul 17, 2007
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations72
US8053371B2Nov 8, 2011
Apparatus and methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC0 citations52