Inventor
GORDON BRIAN F
US29 patents
Patents
29 patentsUS6410459B2Jun 25, 2002
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC539 citations99
US6103636AAug 15, 2000
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC122 citations98
US6329301B1Dec 11, 2001
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC25 citations96
US6898838B2May 31, 2005
Inflatable bladder with suction for supporting circuit board assembly processing
MICRON TECHNOLOGY INC18 citations92
US6610610B2Aug 26, 2003
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC13 citations92
US6506679B2Jan 14, 2003
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC14 citations92
US6316363B1Nov 13, 2001
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC23 citations92
US6447634B1Sep 10, 2002
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC23 citations90
US6232247B1May 15, 2001
Substrate coating apparatus and semiconductor processing method of improving uniformity of liquid deposition
MICRON TECHNOLOGY INC14 citations82
US6857627B2Feb 22, 2005
Inflatable bladder with suction for supporting circuit board assembly processing
MICRON TECHNOLOGY INC5 citations74
US6889698B2May 10, 2005
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations73
US6569241B2May 27, 2003
Substrate spinning apparatus
MICRON TECHNOLOGY INC6 citations73
US6530113B2Mar 11, 2003
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC8 citations73
US6398868B1Jun 4, 2002
Substrate coating apparatus
MICRON TECHNOLOGY INC5 citations73
US7244681B2Jul 17, 2007
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations72
US6749054B2Jun 15, 2004
Printed circuit board support
MICRON TECHNOLOGY INC3 citations71
US6631798B1Oct 14, 2003
Printed circuit board support
MICRON TECHNOLOGY INC5 citations71
US6693034B2Feb 17, 2004
Deadhesion method and mechanism for wafer processing
MICRON TECHNOLOGY INC2 citations63
US6429146B2Aug 6, 2002
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC3 citations63
US6555276B2Apr 29, 2003
Substrate coating and semiconductor processing method of improving uniformity of liquid deposition
MICRON TECHNOLOGY INC4 citations62
US7093704B2Aug 22, 2006
Printed circuit board support
MICRON TECHNOLOGY INC3 citations60
US6971499B2Dec 6, 2005
Printed circuit board support
MICRON TECHNOLOGY INC2 citations60
US6962248B2Nov 8, 2005
Printed circuit board support
MICRON TECHNOLOGY INC1 citations60
US6863169B2Mar 8, 2005
Printed circuit board support
MICRON TECHNOLOGY INC1 citations60
US6863170B2Mar 8, 2005
Printed circuit board support
MICRON TECHNOLOGY INC3 citations60
US8053371B2Nov 8, 2011
Apparatus and methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC0 citations52
US6656402B2Dec 2, 2003
Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52
US6645345B2Nov 11, 2003
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52
US6624089B2Sep 23, 2003
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing
MICRON TECHNOLOGY INC0 citations52