Inventor
NAYAK JAWAHAR P
US14 patents
⚠️ This page may combine multiple inventors who share the name “NAYAK JAWAHAR P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS6429482B1Aug 6, 2002
Halo-free non-rectifying contact on chip with halo source/drain diffusion
IBM46 citations95
US7067902B2Jun 27, 2006
Building metal pillars in a chip for structure support
IBM42 citations92
US6341417B1Jan 29, 2002
Pre-patterned substrate layers for being personalized as needed
IBM19 citations92
US6972209B2Dec 6, 2005
Stacked via-stud with improved reliability in copper metallurgy
IBM32 citations90
US6221193B1Apr 24, 2001
Defect reduction method for screened greensheets and article produced therefrom
IBM20 citations89
US6238741B1May 29, 2001
Single mask screening process
IBM16 citations79
US7456098B2Nov 25, 2008
Building metal pillars in a chip for structure support
IBM8 citations74
US7138714B2Nov 21, 2006
Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines
IBM10 citations73
US6475555B2Nov 5, 2002
Process for screening features on an electronic substrate with a low viscosity paste
IBM7 citations73
US6231707B1May 15, 2001
Method of forming a multilayer ceramic substrate with max-punched vias
IBM8 citations73
US6750109B2Jun 15, 2004
Halo-free non-rectifying contact on chip with halo source/drain diffusion
IBM11 citations72
US5951917ASep 14, 1999
Conductive paste for large greensheet screening including high thixotropic agent content
IBM6 citations69
US5783113AJul 21, 1998
Conductive paste for large greensheet screening including high thixotropic agent content
IBM2 citations58