Inventor
WACHNIK RICHARD A
US17 patents
⚠️ This page may combine multiple inventors who share the name “WACHNIK RICHARD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6417572B1Jul 9, 2002
Process for producing metal interconnections and product produced thereby
IBM105 citations98
US6069068AMay 30, 2000
Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
IBM224 citations98
US6202191B1Mar 13, 2001
Electromigration resistant power distribution network
IBM83 citations95
US7224063B2May 29, 2007
Dual-damascene metallization interconnection
IBM30 citations92
US6518670B1Feb 11, 2003
Electrically porous on-chip decoupling/shielding layer
IBM29 citations92
US6258710B1Jul 10, 2001
Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity
IBM39 citations92
US6531759B2Mar 11, 2003
Alpha particle shield for integrated circuit
IBM19 citations91
US6069051AMay 30, 2000
Method of producing planar metal-to-metal capacitor for use in integrated circuits
IBM34 citations91
US8020138B2Sep 13, 2011
Voltage island performance/leakage screen monitor for IP characterization
IBM9 citations82
US7470613B2Dec 30, 2008
Dual damascene multi-level metallization
IBM7 citations73
US7989922B2Aug 2, 2011
Highly tunable metal-on-semiconductor trench varactor
IBM1 citations52
GLOBALFOUNDRIES INC
4 patentsUS9240406B2Jan 19, 2016
Precision trench capacitor
GLOBALFOUNDRIES INC9 citations84
US9773717B1Sep 26, 2017
Integrated circuits with peltier cooling provided by back-end wiring
GLOBALFOUNDRIES INC6 citations83
US10103083B2Oct 16, 2018
Integrated circuits with Peltier cooling provided by back-end wiring
GLOBALFOUNDRIES INC4 citations72
US9484246B2Nov 1, 2016
Buried signal transmission line
GLOBALFOUNDRIES INC0 citations42