Inventor
TANGPUZ CONNIE
PH3 patents
Patents
3 patentsUS7256479B2Aug 14, 2007
Method to manufacture a universal footprint for a package with exposed chip
FAIRCHILD SEMICONDUCTOR62 citations96
US6661082B1Dec 9, 2003
Flip chip substrate design
FAIRCHILD SEMICONDUCTOR71 citations92
US7101734B2Sep 5, 2006
Flip chip substrate design
FAIRCHILD SEMICONDUCTOR15 citations80