Inventor
AIBA YOSHITAKA
JP20 patents
⚠️ This page may combine multiple inventors who share the name “AIBA YOSHITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
15 patentsUS7122897B2Oct 17, 2006
Semiconductor device and method of manufacturing the semiconductor device
FUJITSU LTD72 citations98
US6548898B2Apr 15, 2003
External connection terminal and semiconductor device
FUJITSU LTD98 citations98
US6476503B1Nov 5, 2002
Semiconductor device having columnar electrode and method of manufacturing same
FUJITSU LTD266 citations98
US6348728B1Feb 19, 2002
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
FUJITSU LTD91 citations98
US7084513B2Aug 1, 2006
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
FUJITSU LTD91 citations97
US6333564B1Dec 25, 2001
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
FUJITSU LTD87 citations97
US7456089B2Nov 25, 2008
Semiconductor device and method of manufacturing the semiconductor device
FUJITSU LTD53 citations96
US6836025B2Dec 28, 2004
Semiconductor device configured to be surface mountable
FUJITSU LTD61 citations96
US6909181B2Jun 21, 2005
Light signal processing system
FUJITSU LTD34 citations92
US6784543B2Aug 31, 2004
External connection terminal and semiconductor device
FUJITSU LTD30 citations92
US6586273B2Jul 1, 2003
Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
FUJITSU LTD28 citations92
US6967399B2Nov 22, 2005
Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
FUJITSU LTD8 citations74
US6627479B2Sep 30, 2003
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
FUJITSU LTD5 citations74
US7365434B2Apr 29, 2008
Semiconductor device and manufacturing method for the same
FUJITSU LTD2 citations63
US7251801B2Jul 31, 2007
Method of designing circuit board
FUJITSU LTD6 citations62
FUJITSU SEMICONDUCTOR LTD
3 patentsUS9076789B2Jul 7, 2015
Semiconductor device having a high frequency external connection electrode positioned within a via hole
FUJITSU SEMICONDUCTOR LTD8 citations84
US7759246B2Jul 20, 2010
Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
FUJITSU SEMICONDUCTOR LTD9 citations84
US8344490B2Jan 1, 2013
Semiconductor device having a high frequency electrode positioned with a via hole
FUJITSU SEMICONDUCTOR LTD8 citations79