Inventor
LEE YORIM
KR5 patents
⚠️ This page may combine multiple inventors who share the name “LEE YORIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
4 patentsUS7615865B2Nov 10, 2009
Standoff height improvement for bumping technology using solder resist
STATS CHIPPAC LTD8 citations82
US7898072B2Mar 1, 2011
Package stacking system with mold contamination prevention
STATS CHIPPAC LTD5 citations71
US7682872B2Mar 23, 2010
Integrated circuit package system with underfill
STATS CHIPPAC LTD4 citations60
US7875495B2Jan 25, 2011
Standoff height improvement for bumping technology using solder resist
STATS CHIPPAC LTD1 citations50