Inventor
GARDNER SANAZ K
US50 patents
⚠️ This page may combine multiple inventors who share the name “GARDNER SANAZ K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
44 patentsUS10325774B2Jun 18, 2019
Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon CMOS-compatible semiconductor devices
INTEL CORP8 citations84
US10249740B2Apr 2, 2019
Ge nano wire transistor with GaAs as the sacrificial layer
INTEL CORP7 citations84
US10229991B2Mar 12, 2019
III-N epitaxial device structures on free standing silicon mesas
INTEL CORP6 citations84
US10056456B2Aug 21, 2018
N-channel gallium nitride transistors
INTEL CORP8 citations84
US9806203B2Oct 31, 2017
Nonplanar III-N transistors with compositionally graded semiconductor channels
INTEL CORP7 citations84
US9660064B2May 23, 2017
Low sheet resistance GaN channel on Si substrates using InAlN and AlGaN bi-layer capping stack
INTEL CORP15 citations84
US9373693B2Jun 21, 2016
Nonplanar III-N transistors with compositionally graded semiconductor channels
INTEL CORP5 citations84
US11056532B2Jul 6, 2021
Techniques for monolithic co-integration of polycrystalline thin-film bulk acoustic resonator devices and monocrystalline III-N semiconductor transistor devices
INTEL CORP2 citations73
US10930766B2Feb 23, 2021
Ge NANO wire transistor with GAAS as the sacrificial layer
INTEL CORP3 citations73
US10930500B2Feb 23, 2021
Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon CMOS-compatible semiconductor devices
INTEL CORP3 citations73
US10840352B2Nov 17, 2020
Nanowire transistors with embedded dielectric spacers
INTEL CORP3 citations73
US10665708B2May 26, 2020
Semiconductor devices with raised doped crystalline structures
INTEL CORP4 citations73
US10475888B2Nov 12, 2019
Integration of III-V devices on Si wafers
INTEL CORP2 citations73
US10431690B2Oct 1, 2019
High electron mobility transistors with localized sub-fin isolation
INTEL CORP3 citations73
US9922826B2Mar 20, 2018
Integrated circuit die having reduced defect group III-nitride layer and methods associated therewith
INTEL CORP2 citations73
US9698013B2Jul 4, 2017
Methods and structures to prevent sidewall defects during selective epitaxy
INTEL CORP5 citations73
US9673045B2Jun 6, 2017
Integration of III-V devices on Si wafers
INTEL CORP3 citations73
US10249742B2Apr 2, 2019
Offstate parasitic leakage reduction for tunneling field effect transistors
INTEL CORP3 citations72
US9660085B2May 23, 2017
Wide band gap transistors on non-native semiconductor substrates and methods of manufacture thereof
INTEL CORP6 citations72
US9640422B2May 2, 2017
III-N devices in Si trenches
INTEL CORP3 citations72
US11195944B2Dec 7, 2021
Gallium nitride (GaN) transistor structures on a substrate
INTEL CORP0 citations63
US11177376B2Nov 16, 2021
III-N epitaxial device structures on free standing silicon mesas
INTEL CORP1 citations63
US11114556B2Sep 7, 2021
Gate stack design for GaN e-mode transistor performance
INTEL CORP0 citations63
US10998260B2May 4, 2021
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
INTEL CORP0 citations63
US10903364B2Jan 26, 2021
Semiconductor device with released source and drain
INTEL CORP0 citations63
US10804386B2Oct 13, 2020
Gate stack design for GaN e-mode transistor performance
INTEL CORP1 citations63
US10756183B2Aug 25, 2020
N-channel gallium nitride transistors
INTEL CORP1 citations63
US10593785B2Mar 17, 2020
Transistors having ultra thin fin profiles and their methods of fabrication
INTEL CORP1 citations63
US10388777B2Aug 20, 2019
Heteroepitaxial structures with high temperature stable substrate interface material
INTEL CORP1 citations63
US11631737B2Apr 18, 2023
Ingaas epi structure and wet etch process for enabling III-v GAA in art trench
INTEL CORP0 citations52
US10850977B2Dec 1, 2020
Group III-N MEMS structures on a group IV substrate
INTEL CORP0 citations52
US10784352B2Sep 22, 2020
Method to achieve a uniform Group IV material layer in an aspect ratio trapping trench
INTEL CORP0 citations52
US10644137B2May 5, 2020
III-V finfet transistor with V-groove S/D profile for improved access resistance
INTEL CORP0 citations52
US10574187B2Feb 25, 2020
Envelope-tracking control techniques for highly-efficient RF power amplifiers
INTEL CORP0 citations52
US10553689B2Feb 4, 2020
Multiple stacked field-plated GaN transistor and interlayer dielectrics to improve breakdown voltage and reduce parasitic capacitances
INTEL CORP0 citations52
US10546927B2Jan 28, 2020
Self-aligned transistor structures enabling ultra-short channel lengths
INTEL CORP0 citations52
US10211327B2Feb 19, 2019
Semiconductor devices with raised doped crystalline structures
INTEL CORP0 citations52
US10096474B2Oct 9, 2018
Methods and structures to prevent sidewall defects during selective epitaxy
INTEL CORP1 citations52
US10084043B2Sep 25, 2018
High mobility nanowire fin channel on silicon substrate formed using sacrificial sub-fin
INTEL CORP1 citations52
US10204989B2Feb 12, 2019
Method of fabricating semiconductor structures on dissimilar substrates
INTEL CORP0 citations51
US10096682B2Oct 9, 2018
III-N devices in Si trenches
INTEL CORP0 citations50
US10622448B2Apr 14, 2020
Transistors including retracted raised source/drain to reduce parasitic capacitances
INTEL CORP0 citations42
US10217673B2Feb 26, 2019
Integrated circuit die having reduced defect group III-nitride structures and methods associated therewith
INTEL CORP0 citations42
US9698222B2Jul 4, 2017
Method of fabricating semiconductor structures on dissimilar substrates
INTEL CORP0 citations40
THEN HAN WUI
2 patentsTAHOE RES LTD
2 patentsUS12148690B2Nov 19, 2024
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
TAHOE RES LTD0 citations63
US11587862B2Feb 21, 2023
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
TAHOE RES LTD0 citations63