P

Inventor

GARDNER SANAZ K

US50 patents
⚠️ This page may combine multiple inventors who share the name “GARDNER SANAZ K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

44 patents
US10325774B2Jun 18, 2019

Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon CMOS-compatible semiconductor devices

INTEL CORP8 citations84
US10249740B2Apr 2, 2019

Ge nano wire transistor with GaAs as the sacrificial layer

INTEL CORP7 citations84
US10229991B2Mar 12, 2019

III-N epitaxial device structures on free standing silicon mesas

INTEL CORP6 citations84
US10056456B2Aug 21, 2018

N-channel gallium nitride transistors

INTEL CORP8 citations84
US9806203B2Oct 31, 2017

Nonplanar III-N transistors with compositionally graded semiconductor channels

INTEL CORP7 citations84
US9660064B2May 23, 2017

Low sheet resistance GaN channel on Si substrates using InAlN and AlGaN bi-layer capping stack

INTEL CORP15 citations84
US9373693B2Jun 21, 2016

Nonplanar III-N transistors with compositionally graded semiconductor channels

INTEL CORP5 citations84
US11056532B2Jul 6, 2021

Techniques for monolithic co-integration of polycrystalline thin-film bulk acoustic resonator devices and monocrystalline III-N semiconductor transistor devices

INTEL CORP2 citations73
US10930766B2Feb 23, 2021

Ge NANO wire transistor with GAAS as the sacrificial layer

INTEL CORP3 citations73
US10930500B2Feb 23, 2021

Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon CMOS-compatible semiconductor devices

INTEL CORP3 citations73
US10840352B2Nov 17, 2020

Nanowire transistors with embedded dielectric spacers

INTEL CORP3 citations73
US10665708B2May 26, 2020

Semiconductor devices with raised doped crystalline structures

INTEL CORP4 citations73
US10475888B2Nov 12, 2019

Integration of III-V devices on Si wafers

INTEL CORP2 citations73
US10431690B2Oct 1, 2019

High electron mobility transistors with localized sub-fin isolation

INTEL CORP3 citations73
US9922826B2Mar 20, 2018

Integrated circuit die having reduced defect group III-nitride layer and methods associated therewith

INTEL CORP2 citations73
US9698013B2Jul 4, 2017

Methods and structures to prevent sidewall defects during selective epitaxy

INTEL CORP5 citations73
US9673045B2Jun 6, 2017

Integration of III-V devices on Si wafers

INTEL CORP3 citations73
US10249742B2Apr 2, 2019

Offstate parasitic leakage reduction for tunneling field effect transistors

INTEL CORP3 citations72
US9660085B2May 23, 2017

Wide band gap transistors on non-native semiconductor substrates and methods of manufacture thereof

INTEL CORP6 citations72
US9640422B2May 2, 2017

III-N devices in Si trenches

INTEL CORP3 citations72
US11195944B2Dec 7, 2021

Gallium nitride (GaN) transistor structures on a substrate

INTEL CORP0 citations63
US11177376B2Nov 16, 2021

III-N epitaxial device structures on free standing silicon mesas

INTEL CORP1 citations63
US11114556B2Sep 7, 2021

Gate stack design for GaN e-mode transistor performance

INTEL CORP0 citations63
US10998260B2May 4, 2021

Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances

INTEL CORP0 citations63
US10903364B2Jan 26, 2021

Semiconductor device with released source and drain

INTEL CORP0 citations63
US10804386B2Oct 13, 2020

Gate stack design for GaN e-mode transistor performance

INTEL CORP1 citations63
US10756183B2Aug 25, 2020

N-channel gallium nitride transistors

INTEL CORP1 citations63
US10593785B2Mar 17, 2020

Transistors having ultra thin fin profiles and their methods of fabrication

INTEL CORP1 citations63
US10388777B2Aug 20, 2019

Heteroepitaxial structures with high temperature stable substrate interface material

INTEL CORP1 citations63
US11631737B2Apr 18, 2023

Ingaas epi structure and wet etch process for enabling III-v GAA in art trench

INTEL CORP0 citations52
US10850977B2Dec 1, 2020

Group III-N MEMS structures on a group IV substrate

INTEL CORP0 citations52
US10784352B2Sep 22, 2020

Method to achieve a uniform Group IV material layer in an aspect ratio trapping trench

INTEL CORP0 citations52
US10644137B2May 5, 2020

III-V finfet transistor with V-groove S/D profile for improved access resistance

INTEL CORP0 citations52
US10574187B2Feb 25, 2020

Envelope-tracking control techniques for highly-efficient RF power amplifiers

INTEL CORP0 citations52
US10553689B2Feb 4, 2020

Multiple stacked field-plated GaN transistor and interlayer dielectrics to improve breakdown voltage and reduce parasitic capacitances

INTEL CORP0 citations52
US10546927B2Jan 28, 2020

Self-aligned transistor structures enabling ultra-short channel lengths

INTEL CORP0 citations52
US10211327B2Feb 19, 2019

Semiconductor devices with raised doped crystalline structures

INTEL CORP0 citations52
US10096474B2Oct 9, 2018

Methods and structures to prevent sidewall defects during selective epitaxy

INTEL CORP1 citations52
US10084043B2Sep 25, 2018

High mobility nanowire fin channel on silicon substrate formed using sacrificial sub-fin

INTEL CORP1 citations52
US10204989B2Feb 12, 2019

Method of fabricating semiconductor structures on dissimilar substrates

INTEL CORP0 citations51
US10096682B2Oct 9, 2018

III-N devices in Si trenches

INTEL CORP0 citations50
US10622448B2Apr 14, 2020

Transistors including retracted raised source/drain to reduce parasitic capacitances

INTEL CORP0 citations42
US10217673B2Feb 26, 2019

Integrated circuit die having reduced defect group III-nitride structures and methods associated therewith

INTEL CORP0 citations42
US9698222B2Jul 4, 2017

Method of fabricating semiconductor structures on dissimilar substrates

INTEL CORP0 citations40

THEN HAN WUI

2 patents

TAHOE RES LTD

2 patents

RADOSAVLJEVIC MARKO

1 patent

GOEL NITI

1 patent