Inventor

KIM WOON-BAE

KR84 patents

⚠️ This page may combine multiple inventors who share the name “KIM WOON-BAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM WOON-BAE

SAMSUNG ELECTRONICS CO LTD

Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions

Micro-package, multi-stack micro-package, and manufacturing method therefor

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Image sensor module and fabrication method thereof

Electroactive polymer actuator and manufacturing method thereof

Tunable capacitor using electrowetting phenomenon

Micro-element package having a dual-thickness substrate and manufacturing method thereof

Optical lens and method of manufacturing the same

Micro-package, multi-stack micro-package, and manufacturing method therefor

Low temperature hermetic sealing method having passivation layer

Wafer level hermetic sealing method

Micro-mechanical device having anti-stiction layer and method of manufacturing the device

Magneto-optical head for magneto-optical reading and writing system

Packaging chip having interconnection electrodes directly connected to plural wafers

Wafer level package for surface acoustic wave device and fabrication method thereof

Image sensor module having electric component and fabrication method thereof

Varifocal optical device

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level packaging cap and fabrication method thereof

High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor

Packaging chip and packaging method thereof

Method for manufacturing micro electro-mechanical systems using solder balls

Wafer level packaging cap and fabrication method thereof

Bulk acoustic resonator including a resonance part with dimple and fabrication method therefor

Multi stack packaging chip and method of manufacturing the same

Chip-on-film semiconductor packages and display apparatus including the same

Chip-on-film semiconductor packages and display apparatus including the same

Multi-touch sensing apparatus using rear view camera of array type

Fiber scanning projector

Micro electric liquid device and apparatus including the same

Chip on film package and display device including the same

Magnetic recording/reproducing apparatus

Metal pillar in a film-type semiconductor package

Tunable capacitor using electrowetting phenomenon

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Wafer level incapsulation chip and encapsulation chip manufacturing method

Image pickup device and method of manufacturing the same

Wafer level packaging cap and fabrication method thereof

Device for opening lids of varying sized tape cassettes in a magnetic recording and reproducing apparatus

Reel driving apparatus for tape recorder

SAMSUNG ELECTRO MECH

Varifocal lens

Cap wafer, semiconductor chip having the same, and fabrication method thereof

KIM WOON-BAE

Flexible image photographing apparatus with a plurality of image forming units and method for manufacturing the same

Micro-shutter device and method of manufacturing the same

LEE JEONG-YUB

Optical lens and manufacturing method thereof

Optical apparatus

KIM CHE-HEUNG

Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same

Micro shutter having iris function, method for manufacturing the same, and micro camera module having the same

CHOI MIN-SEOG

Imaging device including a plurality of imaging units

YI KWON JU

Multi-touch sensing apparatus using rear view camera of array type