Inventor
BAE DAE-LOK
KR22 patents
⚠️ This page may combine multiple inventors who share the name “BAE DAE-LOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS8343851B2Jan 1, 2013
Wafer temporary bonding method using silicon direct bonding
SAMSUNG ELECTRONICS CO LTD239 citations99
US8354308B2Jan 15, 2013
Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate
SAMSUNG ELECTRONICS CO LTD230 citations98
US6150249ANov 21, 2000
Methods of forming niobium-near noble metal contact structures for integrated circuits
SAMSUNG ELECTRONICS CO LTD30 citations89
US6437445B1Aug 20, 2002
Niobium-near noble metal contact structures for integrated circuits
SAMSUNG ELECTRONICS CO LTD10 citations70
US7781302B2Aug 24, 2010
Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions
SAMSUNG ELECTRONICS CO LTD3 citations62
US7605022B2Oct 20, 2009
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
SAMSUNG ELECTRONICS CO LTD4 citations59
US9831164B2Nov 28, 2017
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US8867882B2Oct 21, 2014
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
SAMSUNG ELECTRONICS CO LTD1 citations52
US8958002B2Feb 17, 2015
Image sensors
SAMSUNG ELECTRONICS CO LTD0 citations51
US7932163B2Apr 26, 2011
Methods of forming stacked semiconductor devices with single-crystal semiconductor regions
SAMSUNG ELECTRONICS CO LTD0 citations51
KANG PIL-KYU
7 patentsUS8873901B2Oct 28, 2014
Buried-type optical input/output devices and methods of manufacturing the same
KANG PIL-KYU6 citations84
US8129833B2Mar 6, 2012
Stacked integrated circuit packages that include monolithic conductive vias
KANG PIL-KYU13 citations84
US9103974B2Aug 11, 2015
Semiconductor devices having optical transceiver
KANG PIL-KYU5 citations73
US8422845B2Apr 16, 2013
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
KANG PIL-KYU4 citations62
US8319329B2Nov 27, 2012
Stacked integrated circuit package having recessed sidewalls
KANG PIL-KYU3 citations62
US8735265B2May 27, 2014
Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process
KANG PIL-KYU0 citations52
US8324055B2Dec 4, 2012
Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate
KANG PIL-KYU0 citations41