Inventor

QI BO

US29 patents

⚠️ This page may combine multiple inventors who share the name “QI BO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QI BO

APPLIED MATERIALS INC

3D NAND etch

Molecular layer deposition method and system

Processes for depositing SiB films

Defect free germanium oxide gap fill

Super-conformal germanium oxide films

Low-k boron carbonitride films

Diffusion barriers for germanium

Defect free germanium oxide gap fill

Hydrogen free silicon dioxide

Thermal deposition of doped silicon oxide

Processes for depositing sib films

Conformal silicon oxide film deposition

HDP sacrificial carbon gapfill

Catalytic formation of boron and carbon films

3D NAND etch

Processes to deposit amorphous-silicon etch protection liner

Deposition of low-stress boron-containing layers

Deposition of low-stress carbon-containing layers

Methods of forming high boron-content hard mask materials

Molecular layer deposition of amorphous carbon films

Catalytic thermal deposition of carbon-containing materials

Doping semiconductor films

Non-conformal high selectivity film for etch critical dimension control

HUAWEI TECH CO LTD

Method and apparatus for compiling source code object, and computer

Method and apparatus for compiling source code object, and computer

GENERON SHANGHAI CORP LTD

Multispecific fab fusion proteins and use thereof

QI BO

High-throughput HDP-CVD processes for advanced gapfill applications

STATE GRID CORP CHINA

Post insulator and direct current power transmission device

FIO CORP

Method for stabilizing quantum-dots