Inventor
CHOONG LIEN WAH
SG3 patents
Patents
3 patentsUS6656769B2Dec 2, 2003
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
MICRON TECHNOLOGY INC26 citations84
US10199299B1Feb 5, 2019
Semiconductor mold compound transfer system and associated methods
MICRON TECHNOLOGY INC2 citations65
US10658256B2May 19, 2020
Semiconductor mold compound transfer system and associated methods
MICRON TECHNOLOGY INC0 citations44