Inventor
He jian-yang
TW4 patents
Patents
4 patentsUS12272663B2Apr 8, 2025
Metal-bump sidewall protection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11476219B2Oct 18, 2022
Metal-bump sidewall protection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12500195B2Dec 16, 2025
Connecting structure, package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10784222B2Sep 22, 2020
Metal-bump sidewall protection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49