Inventor

IM YUNHYEOK

KR19 patents

⚠️ This page may combine multiple inventors who share the name “IM YUNHYEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IM YUNHYEOK

SAMSUNG ELECTRONICS CO LTD

Semiconductor package device

Semiconductor package having a heat slug and a spacer

Semiconductor package

Semiconductor package having improved heat dissipation characteristics

Semiconductor package including composite molding structure

Semiconductor package including composite molding structure

Semiconductor package including a heat dissipation structure

Semiconductor module including heat dissipation layer

Semiconductor package

Semiconductor package

Semiconductor package

Method and device for temperature detection and thermal management based on power measurement

IM YUNHYEOK

Semiconductor packages

Packaged semiconductor chips having heat dissipation layers and ground contacts therein

Semiconductor package and method for manufacturing the same

Semiconductor packages including heat diffusion vias and interconnection vias

CHOI MI-NA

Package-on-package devices, methods of fabricating the same, and semiconductor packages

PARK KYOL

Package-on-package device

JANG EON SOO

Semiconductor packages including heat exhaust part