Inventor
SZYMANOWSKI MARGARET A
US26 patents
⚠️ This page may combine multiple inventors who share the name “SZYMANOWSKI MARGARET A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
12 patentsUS11522499B2Dec 6, 2022
Integrated multiple-path power amplifier
NXP USA INC14 citations85
US11018629B2May 25, 2021
Integrated multiple-path power amplifier
NXP USA INC12 citations82
US10587226B2Mar 10, 2020
Amplifier device with harmonic termination circuit
NXP USA INC7 citations82
US10069462B1Sep 4, 2018
Multiple-stage RF amplifier devices
NXP USA INC6 citations68
US11223336B2Jan 11, 2022
Power amplifier integrated circuit with integrated shunt-l circuit at amplifier output
NXP USA INC1 citations62
US11108362B2Aug 31, 2021
Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
NXP USA INC1 citations62
US11277119B2Mar 15, 2022
Digital step attenuator and method for operating a digital step attenuator
NXP USA INC0 citations56
US10566935B2Feb 18, 2020
Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
NXP USA INC0 citations52
US10269729B2Apr 23, 2019
Semiconductor packages having wire bond wall to reduce coupling
NXP USA INC0 citations52
US10630243B2Apr 21, 2020
Semiconductor package having an isolation wall to reduce electromagnetic coupling
NXP USA INC0 citations51
US10476442B2Nov 12, 2019
Semiconductor package having an isolation wall to reduce electromagnetic coupling
NXP USA INC0 citations51
US11159134B2Oct 26, 2021
Multiple-stage power amplifiers and amplifier arrays configured to operate using the same output bias voltage
NXP USA INC0 citations49
FREESCALE SEMICONDUCTOR INC
11 patentsUS9774301B1Sep 26, 2017
Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
FREESCALE SEMICONDUCTOR INC49 citations97
US9647611B1May 9, 2017
Reconfigurable power splitters and amplifiers, and corresponding methods
FREESCALE SEMICONDUCTOR INC22 citations94
US9450547B2Sep 20, 2016
Semiconductor package having an isolation wall to reduce electromagnetic coupling
FREESCALE SEMICONDUCTOR INC18 citations92
US9978691B2May 22, 2018
Semiconductor packages having wire bond wall to reduce coupling
FREESCALE SEMICONDUCTOR INC8 citations84
US7998852B2Aug 16, 2011
Methods for forming an RF device with trench under bond pad feature
FREESCALE SEMICONDUCTOR INC10 citations82
US9589927B2Mar 7, 2017
Packaged RF amplifier devices with grounded isolation structures and methods of manufacture thereof
FREESCALE SEMICONDUCTOR INC12 citations79
US9673164B2Jun 6, 2017
Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
FREESCALE SEMICONDUCTOR INC5 citations73
US9337774B2May 10, 2016
Packaged RF amplifier devices and methods of manufacture thereof
FREESCALE SEMICONDUCTOR INC3 citations71
US9240390B2Jan 19, 2016
Semiconductor packages having wire bond wall to reduce coupling
FREESCALE SEMICONDUCTOR INC2 citations63
US10110170B2Oct 23, 2018
Semiconductor package having an isolation wall to reduce electromagnetic coupling
FREESCALE SEMICONDUCTOR INC1 citations62
US10211784B2Feb 19, 2019
Amplifier architecture reconfiguration
FREESCALE SEMICONDUCTOR INC0 citations41