Inventor

LIN JENG-SHYAN

TW111 patents

⚠️ This page may combine multiple inventors who share the name “LIN JENG-SHYAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN JENG-SHYAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Mechanisms for forming image-sensor device with deep-trench isolation structure

Mechanisms for forming image-sensor device with deep-trench isolation structure

Stacked integrated circuits with redistribution lines

Isolation structure for bond pad structure

Interconnect structure and method of forming same

Pad structure for front side illuminated image sensor

Isolation structure for bond pad structure

Mechanisms for forming image-sensor device with deep-trench isolation structure

Mechanisms for forming image sensor device with deep-trench isolation structure

Interconnect structure and method of forming same

3DIC interconnect devices and methods of forming same

Interconnect apparatus and method

3DIC interconnect devices and methods of forming same

Stacked integrated circuits with redistribution lines

Mechanisms for forming image-sensor device with deep-trench isolation structure

Structure and method for 3D image sensor

Pad structure for front side illuminated image sensor

Image sensor device and method of forming same

Image sensor including dual isolation and method of making the same

Interconnect structure for stacked device

Multi-wafer stacking by Ox-Ox bonding

Frontside illuminated (FSI) image sensor with a reflector

Image sensor device and method of forming same

Method and apparatus for low resistance image sensor contact

Stacked integrated circuits with redistribution lines

TAIWAN SEMICONDUCTOR MFG

Vertically integrated image sensor chips and methods for forming the same

Seal ring structure with a metal pad

Backside structure for a BSI image sensor device

Semiconductor device having enhanced photo sensitivity and method for manufacture thereof

Method of fabricating a high quantum efficiency photodiode

Imaging sensor structure and method

Method of implantation

Interconnect structure and method

Quantum efficiency enhancement for CMOS imaging sensor with borderless contact

Front side implanted guard ring structure for backside

LIN JENG-SHYAN

Image sensor device and method

Apparatus and method for reducing cross talk in image sensors

Seal ring structure with metal pad

Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips

Dual shallow trench isolation and related applications

WANG WEN-DE

Pad design for backside illuminated image sensor

Front side implanted guard ring structure for backside illuminated image sensor

Image sensor and method of fabricating same

TSAI SHUANG-JI

Backside illumination sensor having a bonding pad structure and method of making the same

Image sensor structure to reduce cross-talk and improve quantum efficiency

LIU HAN-CHI

Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same

CHEN U-TING

Scribe lines in wafers

CHUANG CHUN-CHIEH

Backside illuminated image sensor having capacitor on pixel region

YAUNG DUN-NIAN

Multiple seal ring structure

HO CHENG-YING

CMOS image sensor and method for forming the same