Inventor
TSAI SHU-TING
TW58 patents
⚠️ This page may combine multiple inventors who share the name “TSAI SHU-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
41 patentsUS11596800B2Mar 7, 2023
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US11798916B2Oct 24, 2023
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations85
US10056353B2Aug 21, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9764153B2Sep 19, 2017
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9553020B2Jan 24, 2017
Interconnect structure for connecting dies and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9543257B2Jan 10, 2017
3DIC interconnect devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9536777B2Jan 3, 2017
Interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9455158B2Sep 27, 2016
3DIC interconnect devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9412719B2Aug 9, 2016
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9917121B2Mar 13, 2018
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11011567B2May 18, 2021
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10535706B2Jan 14, 2020
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10304818B2May 28, 2019
Method of manufacturing semiconductor devices having conductive plugs with varying widths
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10157959B2Dec 18, 2018
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10096515B2Oct 9, 2018
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9941249B2Apr 10, 2018
Multi-wafer stacking by Ox-Ox bonding
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9865645B2Jan 9, 2018
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9536920B2Jan 3, 2017
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11315972B2Apr 26, 2022
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269843B2Apr 23, 2019
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11769781B2Sep 26, 2023
Backside illuminated global shutter image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018177B2May 25, 2021
Backside illuminated global shutter image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10157891B2Dec 18, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9525003B2Dec 20, 2016
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12476224B2Nov 18, 2025
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381195B2Aug 5, 2025
Semiconductor devices and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11916091B2Feb 27, 2024
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915977B2Feb 27, 2024
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10978345B2Apr 13, 2021
Interconnect structure for stacked device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861899B2Dec 8, 2020
Interconnect structure for stacked device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10840287B2Nov 17, 2020
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10818720B2Oct 27, 2020
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10763292B2Sep 1, 2020
Interconnect apparatus and method for a stacked semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10682523B2Jun 16, 2020
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510729B2Dec 17, 2019
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10361234B2Jul 23, 2019
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10283547B2May 7, 2019
Stacked image sensor having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163956B2Dec 25, 2018
Interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10092768B2Oct 9, 2018
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941320B2Apr 10, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9812409B2Nov 7, 2017
Seal ring structure with a metal pad
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
7 patentsUS9035445B2May 19, 2015
Seal ring structure with a metal pad
TAIWAN SEMICONDUCTOR MFG14 citations93
US8461021B2Jun 11, 2013
Multiple seal ring structure
TAIWAN SEMICONDUCTOR MFG17 citations91
US9287312B2Mar 15, 2016
Imaging sensor structure and method
TAIWAN SEMICONDUCTOR MFG7 citations84
US9041206B2May 26, 2015
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG11 citations83
US9293392B2Mar 22, 2016
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG4 citations82
US9059061B2Jun 16, 2015
Structure and method for 3D image sensor
TAIWAN SEMICONDUCTOR MFG3 citations63
US9076715B2Jul 7, 2015
Interconnect structure for connecting dies and methods of forming the same
TAIWAN SEMICONDUCTOR MFG2 citations62
LIN JENG-SHYAN
1 patentYAUNG DUN-NIAN
1 patentShowing the top 50 of 58 patents by PatentIndex Score.