Inventor

LEE KYUNGHOON

KR73 patents

⚠️ This page may combine multiple inventors who share the name “LEE KYUNGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KYUNGHOON

SAMSUNG ELECTRONICS CO LTD

Display screen or portion thereof with graphical user interface

Touch analog front end and touch sensor controller having the same

Apparatus and method for positioning terminal in wireless communication system

Apparatus and method for measuring position

Electronic device for reporting communication quality measurement result and method of operating electronic device

Terminal synchronization method and apparatus for use in wireless communication network

Electronic device for requesting NSSAI in wireless communication network and method thereof

Method of accessing network based on access technology and electronic device therefor

Method of accessing network based on access technology and electronic device therefor

Electronic device for operating a cellular communication and method for the same

Correlated double sampling circuit and image sensor including the same

Electronic device for preventing packet drop for uplink transmission

LG DISPLAY CO LTD

Organic light-emitting display device and method of manufacturing the same

Organic light emitting display device and method for manufacturing the same

Display device and method of manufacturing the same

Source printed circuit board and display device

Display device comprising a substrate having a first subpixel and a second subpixel and method for manufacturing the same

Display device having an oxide insulating film between subpixels and method for manufacturing the same

Display device, and method for manufacturing the same

Display device and method for manufacturing the same

Organic light emitting display device having bank with bankhole

Electroluminescent display apparatus

STATS CHIPPAC LTD

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material

Stacked integrated circuit package system

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure

LEE KYUNGHOON

Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material

Integrated circuit packaging system with underfill and methods of manufacture thereof

Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die

Semiconductor device and method of depositing underfill material with uniform flow rate

LG ELECTRONICS INC

BLDC motor and cleaner having the same

BLDC motor and cleaner having the same

Motor driving apparatus

Methods and apparatus for controlling an inverter of a motor driving apparatus

KIM OHHAN

Semiconductor device and method of forming a thermally reinforced semiconductor die

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

LEE JAEHYUN

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure

CHOI DAESIK

Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material

KIM SUN MI

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

KIM YOUNGCHUL

Integrated circuit packaging system with connection structure and method of manufacture thereof

PARK YISU

Integrated circuit packaging system having warpage prevention structures

STATS CHIPPAC PTE LTD

Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package

PARK SOOMOON

Integrated circuit package system flip chip

ZHONG ZHAOHUI

Uniform multilayer graphene by chemical vapor deposition