P

Inventor

WU CHIA-TIEN

TW101 patents
⚠️ This page may combine multiple inventors who share the name “WU CHIA-TIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

47 patents
US11158580B2Oct 26, 2021

Semiconductor devices with backside power distribution network and frontside through silicon via

TAIWAN SEMICONDUCTOR MFG CO LTD27 citations94
US10269715B2Apr 23, 2019

Split rail structures located in adjacent metal layers

TAIWAN SEMICONDUCTOR MFG CO LTD29 citations94
US10020261B2Jul 10, 2018

Split rail structures located in adjacent metal layers

TAIWAN SEMICONDUCTOR MFG CO LTD31 citations94
US9418868B1Aug 16, 2016

Method of fabricating semiconductor device with reduced trench distortions

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations92
US9397045B2Jul 19, 2016

Structure and formation method of damascene structure

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11729969B1Aug 15, 2023

Semiconductor device and method of operating the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US11004740B2May 11, 2021

Structure and method for interconnection with self-alignment

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10991618B2Apr 27, 2021

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10475703B2Nov 12, 2019

Structure and formation method of damascene structure

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9716035B2Jul 25, 2017

Combination interconnect structure and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9490136B1Nov 8, 2016

Method of forming trench cut

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9431297B2Aug 30, 2016

Method of forming an interconnect structure for a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11842967B2Dec 12, 2023

Semiconductor devices with backside power distribution network and frontside through silicon via

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11764106B2Sep 19, 2023

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11018157B2May 25, 2021

Local interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10957580B2Mar 23, 2021

Metal routing with flexible space formed using self-aligned spacer patterning

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10930551B2Feb 23, 2021

Methods for fabricating a low-resistance interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10734275B2Aug 4, 2020

Metal routing with flexible space formed using self-aligned spacer patterning

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10529617B2Jan 7, 2020

Metal routing with flexible space formed using self-aligned spacer patterning

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163654B2Dec 25, 2018

Method of fabricating semiconductor device with reduced trench distortions

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10026647B2Jul 17, 2018

Multi-metal fill with self-align patterning

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9997404B2Jun 12, 2018

Method of forming an interconnect structure for a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9583383B2Feb 28, 2017

Air gap forming techniques based on anodic alumina for interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9412652B2Aug 9, 2016

Air gap forming techniques based on anodic alumina for interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10777452B2Sep 15, 2020

Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations69
US12476197B2Nov 18, 2025

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12400964B2Aug 26, 2025

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12300623B2May 13, 2025

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12283477B2Apr 22, 2025

Method of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12278143B2Apr 15, 2025

Method of providing a workpiece including low resistance interconnect low-resistance interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12080593B2Sep 3, 2024

Barrier-less structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11967560B2Apr 23, 2024

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11923273B2Mar 5, 2024

Method of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11848190B2Dec 19, 2023

Barrier-less structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11817392B2Nov 14, 2023

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11769695B2Sep 26, 2023

Semiconductor structure including low-resistance interconnect and integrated circuit device having the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11715636B2Aug 1, 2023

Method of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11637064B2Apr 25, 2023

Advanced metal connection with metal cut

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11482473B2Oct 25, 2022

Semiconductor device, and associated method and system

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11257670B2Feb 22, 2022

Method of manufacturing a semiconductor device, and associated semiconductor device and system

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10879120B2Dec 29, 2020

Self aligned via and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US9412649B1Aug 9, 2016

Method of fabricating semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US9076790B1Jul 7, 2015

Air gap forming techniques based on anodic alumina for interconnect structures

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations63
US12394633B2Aug 19, 2025

Method of fabricating semiconductor device with reduced trench distortions

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12388016B2Aug 12, 2025

Deep lines and shallow lines in signal conducting paths

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381145B2Aug 5, 2025

Signal conducting line arrangements in integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230534B2Feb 18, 2025

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

(unassigned)

3 patents

Showing the top 50 of 101 patents by PatentIndex Score.