Inventor

SHE YONG

CN24 patents

⚠️ This page may combine multiple inventors who share the name “SHE YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHE YONG

INTEL CORP

Method, apparatus and system to interconnect packaged integrated circuit dies

Flexible system-in-package solutions for wearable devices

Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same

Die stack with reduced warpage

Stair-stacked dice device in a system in package, and methods of making same

Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same

Stair-stacked dice device in a system in package, and methods of making same

Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same

Method, apparatus and system to interconnect packaged integrated circuit dies

3D package having edge-aligned die stack with direct inter-die wire connections

Electronic device package

Film in substrate for releasing z stack-up constraint

Power enhanced stacked chip scale package solution with integrated die attach film

Interconnect structure fabricated using lithographic and deposition processes

Power enhanced stacked chip scale package solution with integrated die attach film

Wire bond connection with intermediate contact structure

Die stack with reduced warpage

Integrated circuit package with glass spacer

Integrated circuit package with glass spacer

Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement

Electronic device package

Stacked die semiconductor package spacer die

Pre-molded active IC of passive components to miniaturize system in package

HUAWEI TECH CO LTD

Chip transfer method and electronic device