Inventor
SASAKURA KAZUMASA
JP12 patents
Patents
12 patentsUS5897049AApr 27, 1999
Method for wire-bonding a covered wire
SHINKAWA KK27 citations92
US5891796AApr 6, 1999
Method for wire-bonding a covered wire
SHINKAWA KK29 citations92
US5214259AMay 25, 1993
Method and apparatus for forming a ball at a bonding wire end
SHINKAWA KK26 citations92
US5797388AAug 25, 1998
Wire-bonding apparatus and method using a covered wire
SHINKAWA KK19 citations83
US5988482ANov 23, 1999
Discharge abnormality detection device and method for use in wire bonding apparatus
SHINKAWA KK14 citations73
US5816480AOct 6, 1998
Method for cleaning a bonding tool used on covered bonding wires
SHINKAWA KK11 citations73
US5776786AJul 7, 1998
Method for wire-bonding a covered wire
SHINKAWA KK11 citations73
US5723364AMar 3, 1998
Method for wire-bonding a covered wire
SHINKAWA KK6 citations62
US6129255AOct 10, 2000
Wire bonding apparatus
SHINKAWA KK5 citations61
US10607959B2Mar 31, 2020
Discharge examination device, wire-bonding apparatus, and discharge examination method
SHINKAWA KK1 citations59
US6491203B2Dec 10, 2002
Wire bonding apparatus
SHINKAWA KK0 citations51
US10410992B2Sep 10, 2019
Ball forming device, wire-bonding apparatus, and ball formation method
SHINKAWA KK0 citations44