Inventor

SEKINE YUKI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “SEKINE YUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKAWA KK

2 patents

US10607959B2Mar 31, 2020

Discharge examination device, wire-bonding apparatus, and discharge examination method

SHINKAWA KK1 citations59

US11004821B2May 11, 2021

Wire bonding method and wire bonding apparatus

SHINKAWA KK1 citations53

YAHOO JAPAN CORP

1 patent

US9467929B2Oct 11, 2016

Wireless terminal, information providing method, and information providing system

YAHOO JAPAN CORP7 citations76