Inventor
LEE SHLE-GE
KR10 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHLE-GE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS11527470B2Dec 13, 2022
Film package and method of fabricating package module
SAMSUNG ELECTRONICS CO LTD1 citations61
US11140772B2Oct 5, 2021
Printed circuit board including warpage offset regions and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11024568B2Jun 1, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11776866B2Oct 3, 2023
Semiconductor module heatspreading lid having integrated separators for multiple chips
SAMSUNG ELECTRONICS CO LTD0 citations50
US10506706B2Dec 10, 2019
Printed circuit board including warpage offset regions and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12564105B2Feb 24, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US10672694B2Jun 2, 2020
Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations46
US9728497B2Aug 8, 2017
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations32