Inventor
MAKABE AKIRA
JP6 patents
⚠️ This page may combine multiple inventors who share the name “MAKABE AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
3 patentsSEIKO EPSON CORP
3 patentsUS6809020B2Oct 26, 2004
Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device
SEIKO EPSON CORP108 citations97
US7579692B2Aug 25, 2009
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
SEIKO EPSON CORP15 citations83
US7355280B2Apr 8, 2008
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
SEIKO EPSON CORP11 citations83