Inventor

PARK YUN MOOK

KR6 patents

⚠️ This page may combine multiple inventors who share the name “PARK YUN MOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEPES CORP

3 patents

US7977789B2Jul 12, 2011

Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same

NEPES CORP64 citations94

US7919833B2Apr 5, 2011

Semiconductor package having a crack-propagation preventing unit

NEPES CORP5 citations59

US7906842B2Mar 15, 2011

Wafer level system in package and fabrication method thereof

NEPES CORP4 citations59

NEPES CO LTD

2 patents

US9564411B2Feb 7, 2017

Semiconductor package and method of manufacturing the same

NEPES CO LTD7 citations78

US11264330B2Mar 1, 2022

Chip package with connection portion that passes through an encapsulation portion

NEPES CO LTD0 citations45

SONG CHI JUNG

1 patent

US8237276B2Aug 7, 2012

Bump structure and fabrication method thereof

SONG CHI JUNG8 citations77