Inventor
HUANG WEI-JIE
TW13 patents
⚠️ This page may combine multiple inventors who share the name “HUANG WEI-JIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS11569183B2Jan 31, 2023
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500113B2Dec 16, 2025
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12441097B2Oct 14, 2025
Lamination process, and manufacturing method of semiconductor package using a chuck
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12391033B2Aug 19, 2025
Lamination process, and manufacturing method of semiconductor package using a chuck
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11993066B2May 28, 2024
Chuck, lamination process, and manufacturing method of semiconductor package using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10867939B2Dec 15, 2020
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
CHI MEI CORP
3 patentsUS9389509B2Jul 12, 2016
Photosensitive polysiloxane composition, protecting film and element having the protecting film
CHI MEI CORP2 citations60
US9851638B2Dec 26, 2017
Photosensitive polysiloxane composition and uses thereof
CHI MEI CORP1 citations50
US9507261B2Nov 29, 2016
Photosensitive composition, protective film, and element having the protective film
CHI MEI CORP0 citations39