Inventor

TSENG YU-JEN

TW17 patents

⚠️ This page may combine multiple inventors who share the name “TSENG YU-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG YU-JEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Conductive contacts having varying widths and method of manufacturing same

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Interconnection structure and method of forming same

Bump-on-trace interconnection structure for flip-chip packages

Interconnection structure

Package having substrate with embedded metal trace overlapped by landing pad

Solderless interconnection structure and method of forming same

Solderless interconnection structure and method of forming same

Solderless interconnection structure and method of forming same

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturing same

TAIWAN SEMICONDUCTOR MFG

Conductive contacts having varying widths and method of manufacturing same

Bump structure and method of forming same

Methods for metal bump die assembly

TSENG YU-JEN

Method for designing a package and substrate layout