Inventor

SHAO TUNG-LIANG

TW81 patents

⚠️ This page may combine multiple inventors who share the name “SHAO TUNG-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHAO TUNG-LIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Semiconductor device and manufacturing method thereof

Package with solder regions aligned to recesses

Capacitor in post-passivation structures and methods of forming the same

Self-alignment structure for wafer level chip scale package

Multi-strike process for bonding

Bonding method of package components and bonding apparatus

Bump structure and fabricating method thereof

Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof

Bonded semiconductor devices and methods of forming the same

Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof

Hollow metal pillar packaging scheme

Package with solder regions aligned to recesses

Semiconductor device and fabricating method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor packages and methods of forming the same

Package with solder regions aligned to recesses

Capacitor in post-passivation structures and methods of forming the same

Thermally enhanced structure for multi-chip device

Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Heat-dissipating structures for semiconductor devices and methods of manufacture

Package devices and methods of manufacture

Bonded semiconductor devices and methods of forming the same

Bonded semiconductor devices and methods of forming the same

Semiconductor device and manufacturing method thereof

Package structure

Package with improved heat dissipation efficiency and method for forming the same

Bonding with pre-deoxide process and apparatus for performing the same

Semiconductor device and manufacturing method thereof

Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications

Semiconductor device and manufacturing method of semiconductor device

Method for forming a semiconductor component with a cooling structure

Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device

TAIWAN SEMICONDUCTOR MFG

Metal insulator metal capacitor and method for making the same

Thermally enhanced structure for multi-chip device

Reducing delamination between an underfill and a buffer layer in a bond structure

Capacitor in post-passivation structures and methods of forming the same

Capacitor in post-passivation structures and methods of forming the same

Capacitor in Post-Passivation structures and methods of forming the same

SHAO TUNG-LIANG

Apparatus and methods for forming through vias

Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device

AU OPTRONICS CORP

Backlight module

Backlight module

YU CHEN-HUA

Thermally enhanced structure for multi-chip device

YU CHUN HUI

Multi-chip wafer level package

APACK TECHNOLOGIES INC

Wafer-level packaging

HUNG CHUN CHANG

Light emitting diode apparatus

TAIWAN SEMICONDUCTOR MANUFACTING COMPANY LTD

Methods for forming through vias