Inventor

TUNG CHIH-HANG

TW84 patents

⚠️ This page may combine multiple inventors who share the name “TUNG CHIH-HANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TUNG CHIH-HANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packages and methods of forming same

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Semiconductor device and manufacturing method thereof

Packaged semiconductor device and method of forming thereof

Semiconductor package device with integrated antenna and manufacturing method thereof

Integrated fan-out package with 3D magnetic core inductor

Semiconductor packages and methods of forming same

Semiconductor package device with integrated antenna and manufacturing method thereof

Semiconductor package device with integrated antenna and manufacturing method thereof

Method of multi-chip wafer level packaging

Functional block stacked 3DIC and method of making same

Multi-strike process for bonding

Semiconductor device and bump formation process

Semiconductor packages and methods of forming same

Integrated fan-out package with 3D magnetic core inductor

Integrated fan-out package with 3D magnetic core inductor

Bonding method of package components and bonding apparatus

Method for manufacturing interconnect structure

Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof

Bonded semiconductor devices and methods of forming the same

Semiconductor packages and methods of forming same

Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor packages and methods of forming the same

Manufacturing method of interconnect structure

Non-planar transistors and methods of fabrication thereof

Thermally enhanced structure for multi-chip device

Two-step direct bonding processes and tools for performing the same

Copper-containing layer on under-bump metallization layer

Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Semiconductor device and bump formation process

Packaged semiconductor device and method of forming thereof

Package

Bonded semiconductor devices and methods of forming the same

Manufacturing method of package

Bonded semiconductor devices and methods of forming the same

YU CHEN-HUA

Thermally enhanced structure for multi-chip device

Joint structure for substrates and methods of forming

Three-dimensional chip stack and method of forming the same

TAIWAN SEMICONDUCTOR MFG

Functional block stacked 3DIC and method of making same

Thermally enhanced structure for multi-chip device

Semiconductor interconnect structure

YU CHUN HUI

Multi-chip wafer level package

SHAO TUNG-LIANG

Apparatus and methods for forming through vias

CHEN YU-FENG

Crack stopper on under-bump metallization layer

TUNG CHIH-HANG

Non-planar transistors and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MANUFACTING COMPANY LTD

Methods for forming through vias