Inventor
ERICKSON KRISTOPHER J
US40 patents
⚠️ This page may combine multiple inventors who share the name “ERICKSON KRISTOPHER J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
39 patentsUS10647053B2May 12, 2020
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO9 citations84
US11911825B2Feb 27, 2024
Fusing electronic components into three-dimensional objects via additive manufacturing processes
HEWLETT PACKARD DEVELOPMENT CO3 citations75
US11396129B2Jul 26, 2022
Increasing electrical conductivity at selected locations of a 3D object
HEWLETT PACKARD DEVELOPMENT CO2 citations73
US10919217B2Feb 16, 2021
Three-dimensional (3D) printing build material composition
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US11511479B2Nov 29, 2022
Temperature control in 3D object formation
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11008479B2May 18, 2021
Fusing agent including a tetraphenyldiamine-based dye
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US12005641B2Jun 11, 2024
Green body including a metal nanoparticle binder
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11904537B2Feb 20, 2024
3D forming objects using high melting temperature polymers
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11878346B2Jan 23, 2024
Objects having cores with nanoparticle binders
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11845129B2Dec 19, 2023
Brown body including a metal nanoparticle binder
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11840016B2Dec 12, 2023
Increasing electrical conductivity at selected locations of a 3D object
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11760010B2Sep 19, 2023
Forming three-dimensional (3D) electronic parts
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US11413815B2Aug 16, 2022
3D forming objects using high melting temperature polymers
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11413687B2Aug 16, 2022
Green body including a metal nanoparticle binder
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11383301B2Jul 12, 2022
Metal-connected particle articles
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11338363B2May 24, 2022
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US11338510B2May 24, 2022
Build material distributing cylinders
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11311942B2Apr 26, 2022
Metal-connected particle articles
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US11167374B2Nov 9, 2021
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US10974322B2Apr 13, 2021
Photonic fusing
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US10968356B2Apr 6, 2021
Coalescent ink
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10889057B2Jan 12, 2021
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10781228B2Sep 22, 2020
Fusing agent including a metal bis(dithiolene) complex
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US12257624B2Mar 25, 2025
Powder bed materials
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11845128B2Dec 19, 2023
Powder bed materials
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11801631B2Oct 31, 2023
Three-dimensional printed part
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11697153B2Jul 11, 2023
Material sets
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US12128612B2Oct 29, 2024
Binder agent
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11981084B2May 14, 2024
Lifecycle condition-based manufacturing alteration
HEWLETT PACKARD DEVELOPMENT CO1 citations60
US11969945B2Apr 30, 2024
Automated handling based on part identifier and location
HEWLETT PACKARD DEVELOPMENT CO1 citations60
US11887177B2Jan 30, 2024
Part re-order based on part-specific sensor data
HEWLETT PACKARD DEVELOPMENT CO1 citations60
US11822995B2Nov 21, 2023
Resonator-based object pose determination
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11498269B2Nov 15, 2022
Post-print processing of three dimensional (3D) printed objects
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11759996B2Sep 19, 2023
Surface feature formation for three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US11738508B2Aug 29, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US11648731B2May 16, 2023
Forming three-dimensional (3D) printed electronics
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US12036734B2Jul 16, 2024
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US11577454B2Feb 14, 2023
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations50
US12017406B2Jun 25, 2024
Three-dimensional printing
HEWLETT PACKARD DEVELOPMENT CO0 citations45