Inventor
HADA SAYURI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “HADA SAYURI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS10595399B2Mar 17, 2020
Method of reducing warpage of an organic substrate
IBM2 citations72
US12166008B2Dec 10, 2024
Injection molded solder head with improved sealing performance
IBM0 citations62
US10325839B2Jun 18, 2019
Reduction of stress in via structure
IBM1 citations62
US10679916B2Jun 9, 2020
Circuit module and manufacturing method thereof
IBM0 citations51
US10074583B2Sep 11, 2018
Circuit module and manufacturing method thereof
IBM1 citations51
US9967971B2May 8, 2018
Method of reducing warpage of an orgacnic substrate
IBM0 citations51
US9672323B2Jun 6, 2017
Reduction of warpage of multilayered substrate or package
IBM1 citations51
US9384314B2Jul 5, 2016
Reduction of warpage of multilayered substrate or package
IBM1 citations51
US9568405B2Feb 14, 2017
Method, apparatus, and structure for determining interposer thickness
IBM0 citations41
US9099315B2Aug 4, 2015
Mounting structure and mounting structure manufacturing method
IBM0 citations41