Inventor

LEUNG PAK KIN

HK6 patents

⚠️ This page may combine multiple inventors who share the name “LEUNG PAK KIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASM ASSEMBLY AUTOMATION LTD

1 patent

US7667355B2Feb 23, 2010

Apparatus for generating amplified cooling air flows

ASM ASSEMBLY AUTOMATION LTD7 citations68

LAW YI KEI

1 patent

US10622329B2Apr 14, 2020

Bond head cooling apparatus

LAW YI KEI2 citations59

ASM TECH SINGAPORE PTE LTD

1 patent

US10312214B2Jun 4, 2019

Atomization mechanism for cooling a bond head

ASM TECH SINGAPORE PTE LTD1 citations53

MA LU

1 patent

US10192847B2Jan 29, 2019

Rapid cooling system for a bond head heater

MA LU1 citations52

HUNG KIN YIK

1 patent

US9281290B2Mar 8, 2016

Bond head for thermal compression die bonding

HUNG KIN YIK2 citations51

ASMPT SINGAPORE PTE LTD

1 patent

US11776930B2Oct 3, 2023

Die bond head apparatus with die holder motion table

ASMPT SINGAPORE PTE LTD0 citations48