Inventor
RAGHAVAN PRASANNA
US5 patents
Patents
5 patentsUS10845552B2Nov 24, 2020
Coreless package architecture for multi-chip opto-electronics
INTEL CORP4 citations72
US10231338B2Mar 12, 2019
Methods of forming trenches in packages structures and structures formed thereby
INTEL CORP2 citations69
US9633937B2Apr 25, 2017
Electronic assembly that includes stacked electronic devices
INTEL CORP5 citations67
US12494441B2Dec 9, 2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
INTEL CORP0 citations59
US11322456B2May 3, 2022
Die back side structures for warpage control
INTEL CORP0 citations59