Inventor

ZHAO JUNNAN

US34 patents

⚠️ This page may combine multiple inventors who share the name “ZHAO JUNNAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHAO JUNNAN

INTEL CORP

Microelectronic assemblies having an integrated capacitor

Microelectronic assemblies having a cooling channel

Phase change material in substrate cavity

Microelectronic assemblies having an integrated capacitor

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Cavity structures in integrated circuit package supports

Galvanic corrosion protection for semiconductor packages

Electronic device including a lateral trace

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Vented lids for integrated circuit packages

Thin film barrier seed metallization in magnetic-plugged through hole inductor

Methods to selectively embed magnetic materials in substrate and corresponding structures

Microelectronic assemblies having an integrated capacitor

Substrate assembly with encapsulated magnetic feature

Magnetic structures in integrated circuit package supports

Methods to embed magnetic material as first layer on coreless substrates and corresponding structures

Magnetic core inductors

Methods to selectively embed magnetic materials in substrate and corresponding structures

Substrate assembly with encapsulated magnetic feature

Methods to embed magnetic material as first layer on coreless substrates and corresponding structures

Embedding magnetic material, in a cored or coreless semiconductor package

Magnetic inductor structures for package devices

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate

Techniques for an inductor at a second level interface

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Semiconductor package substrate with through-hole magnetic core inductor using conductive paste

Techniques for an inductor at a second level interface

High density package substrate formed with dielectric bi-layer

Magnetic bilayer structure for a cored or coreless semiconductor package

Thermal management solutions for integrated circuit packages

Effective heat conduction from hotspot to heat spreader through package substrate

TAHOE RES LTD

Electronic device including a lateral trace