Inventor
BIGLER CHARLES G
US7 patents
Patents
7 patentsUS5517056AMay 14, 1996
Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
MOTOROLA INC239 citations98
US5455200AOct 3, 1995
Method for making a lead-on-chip semiconductor device having peripheral bond pads
MOTOROLA INC56 citations94
US5381036AJan 10, 1995
Lead-on chip semiconductor device having peripheral bond pads
MOTOROLA INC44 citations94
US4837184AJun 6, 1989
Process of making an electronic device package with peripheral carrier structure of low-cost plastic
MOTOROLA INC54 citations94
US5060052AOct 22, 1991
TAB bonded semiconductor device having off-chip power and ground distribution
MOTOROLA INC41 citations92
US5691242ANov 25, 1997
Method for making an electronic component having an organic substrate
MOTOROLA INC21 citations91
US4897602AJan 30, 1990
Electronic device package with peripheral carrier structure of low-cost plastic
MOTOROLA INC34 citations89