Inventor
FAN CHUN HO
HK51 patents
⚠️ This page may combine multiple inventors who share the name “FAN CHUN HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASAT LTD
40 patentsUS7372151B1May 13, 2008
Ball grid array package and process for manufacturing same
ASAT LTD461 citations99
US7009286B1Mar 7, 2006
Thin leadless plastic chip carrier
ASAT LTD117 citations99
US6995460B1Feb 7, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD119 citations99
US6989294B1Jan 24, 2006
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD101 citations99
US6946324B1Sep 20, 2005
Process for fabricating a leadless plastic chip carrier
ASAT LTD182 citations99
US6933176B1Aug 23, 2005
Ball grid array package and process for manufacturing same
ASAT LTD121 citations99
US6635957B2Oct 21, 2003
Leadless plastic chip carrier with etch back pad singulation and die attach pad array
ASAT LTD199 citations99
US7482690B1Jan 27, 2009
Electronic components such as thin array plastic packages and process for fabricating same
ASAT LTD86 citations98
US7371610B1May 13, 2008
Process for fabricating an integrated circuit package with reduced mold warping
ASAT LTD79 citations98
US6987032B1Jan 17, 2006
Ball grid array package and process for manufacturing same
ASAT LTD126 citations98
US6964918B1Nov 15, 2005
Electronic components such as thin array plastic packages and process for fabricating same
ASAT LTD84 citations98
US6933594B2Aug 23, 2005
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD140 citations98
US6818978B1Nov 16, 2004
Ball grid array package with shielding
ASAT LTD112 citations98
US7315080B1Jan 1, 2008
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
ASAT LTD76 citations97
US6979594B1Dec 27, 2005
Process for manufacturing ball grid array package
ASAT LTD92 citations97
US6781242B1Aug 24, 2004
Thin ball grid array package
ASAT LTD91 citations97
US7411289B1Aug 12, 2008
Integrated circuit package with partially exposed contact pads and process for fabricating the same
ASAT LTD101 citations96
US7091581B1Aug 15, 2006
Integrated circuit package and process for fabricating the same
ASAT LTD122 citations96
US7049177B1May 23, 2006
Leadless plastic chip carrier with standoff contacts and die attach pad
ASAT LTD192 citations96
US6800948B1Oct 5, 2004
Ball grid array package
ASAT LTD74 citations96
US6585905B1Jul 1, 2003
Leadless plastic chip carrier with partial etch die attach pad
ASAT LTD226 citations96
US7449771B1Nov 11, 2008
Multiple leadframe laminated IC package
ASAT LTD56 citations95
US7247526B1Jul 24, 2007
Process for fabricating an integrated circuit package
ASAT LTD134 citations95
US6734552B2May 11, 2004
Enhanced thermal dissipation integrated circuit package
ASAT LTD241 citations95
US6734044B1May 11, 2004
Multiple leadframe laminated IC package
ASAT LTD78 citations95
US6982491B1Jan 3, 2006
Sensor semiconductor package and method of manufacturing the same
ASAT LTD91 citations94
US6818472B1Nov 16, 2004
Ball grid array package
ASAT LTD69 citations94
US6429048B1Aug 6, 2002
Metal foil laminated IC package
ASAT LTD78 citations94
US7271032B1Sep 18, 2007
Leadless plastic chip carrier with etch back pad singulation
ASAT LTD43 citations92
US7270867B1Sep 18, 2007
Leadless plastic chip carrier
ASAT LTD34 citations92
US7232755B1Jun 19, 2007
Process for fabricating pad frame and integrated circuit package
ASAT LTD20 citations92
US7226811B1Jun 5, 2007
Process for fabricating a leadless plastic chip carrier
ASAT LTD55 citations92
US7081403B1Jul 25, 2006
Thin leadless plastic chip carrier
ASAT LTD28 citations92
US7015072B2Mar 21, 2006
Method of manufacturing an enhanced thermal dissipation integrated circuit package
ASAT LTD54 citations92
US6872661B1Mar 29, 2005
Leadless plastic chip carrier with etch back pad singulation and die attach pad array
ASAT LTD53 citations92
US6790710B2Sep 14, 2004
Method of manufacturing an integrated circuit package
ASAT LTD56 citations91
US7410830B1Aug 12, 2008
Leadless plastic chip carrier and method of fabricating same
ASAT LTD22 citations87
US6903304B1Jun 7, 2005
Process for dressing molded array package saw blade
ASAT LTD15 citations80
US7033517B1Apr 25, 2006
Method of fabricating a leadless plastic chip carrier
ASAT LTD8 citations74
US7439099B1Oct 21, 2008
Thin ball grid array package
ASAT LTD3 citations62
UBOTIC COMPANY LTD
6 patentsUS9659855B2May 23, 2017
Cavity package with pre-molded substrate
UBOTIC COMPANY LTD3 citations73
US9601413B2Mar 21, 2017
Cavity package with die attach pad
UBOTIC COMPANY LTD3 citations73
US9536812B2Jan 3, 2017
Cavity package with pre-molded cavity leadframe
UBOTIC COMPANY LTD2 citations73
US9257370B2Feb 9, 2016
Cavity package with pre-molded cavity leadframe
UBOTIC COMPANY LTD3 citations73
US10014187B2Jul 3, 2018
Cavity package with pre-molded substrate
UBOTIC COMPANY LTD0 citations52
US9887149B2Feb 6, 2018
Cavity package with die attach pad
UBOTIC COMPANY LTD0 citations52
LIN GERALDINE TSUI YEE
2 patentsFAN CHUN HO
1 patentASM TECH SINGAPORE PTE LTD
1 patentShowing the top 50 of 51 patents by PatentIndex Score.