Inventor

CHUNG EDMUND LOW KWOK

SG2 patents

Patents

2 patents

US7250328B2Jul 31, 2007

Microelectronic component assemblies with recessed wire bonds and methods of making same

MICRON TECHNOLOGY INC5 citations61

US7365424B2Apr 29, 2008

Microelectronic component assemblies with recessed wire bonds and methods of making same

MICRON TECHNOLOGY INC2 citations58